Specialty and advanced packaging gain share in semiconductor wafer fab equipment market
Semiconductor Equipment
Specialty and advanced packaging gain share in semiconductor wafer fab equipment market
Imaging
XPeng’s module Teardowns from our Automotive Track
Photonics and Lighting
OpenLight partners with Jabil on AI, ML datacenter optics
Battery
ANALYST THURSDAY 2024
Computing and Software
STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers
Battery
E.ON joins forces with Quinbrook to invest in its largest battery storage project to date
Power Electronics
Iberdrola will invest €41 billion and hire 10,000 people by 2026 to accelerate electrification
Sensing and Actuating
Ultrahuman in Bangalore, India, has raised $35m in equity and debt for its range of smart ring and wearable monitoring devices.
Intel and Biden admin announce up to $8.5 billion in direct funding under the CHIPS Act
Photonics and Lighting
European industry players unite to accelerate quantum computing capabilities
Photonics and Lighting
Stellantis Ventures invests in breakthrough, cost-effective LiDAR technology for advanced driver assistance systems
Semiconductor Equipment
Semiconductor equipment: market share reshuffles amid memory demand decline
Sensing and Actuating
Exploring gas sensors: assessing technological advances and unveiling business opportunities – An interview with Cubic/Innovaer Technologies
Computing and Software
Yole Group Viewpoint – Automotive Semiconductor Innovation: Driving for the Next-Gen ADAS
Computing and Software
STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers
Compound Semiconductor
The unfulfilled promise of silicon carbide
Imaging
Oculi’s ‘software-defined’ vision sensor is fresh and foreign
Semiconductor Packaging
Arizona State University and Deca Technologies to pioneer North America’s first R&D center for advanced fan-out wafer-level packaging
Computing and Software
Nvidia reveals Blackwell B200 GPU, the ‘world’s most powerful chip’ for AI
Photonics and Lighting